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Goodix Bluetooth IC GR551X Series

The Goodix bluetooth IC GR551x family is a single-mode, low-power Bluetooth 5.1 System-on-Chip (SoC). It can be configured as a Broadcaster, an Observer, a Central, or a Peripheral and supports the combination of all the above roles, making it an ideal choice for Internet of Things (IoT) and smart wearable devices.

SKU GR551x Category

1. Goodix Bluetooth IC GR551x series Overview

The Goodix bluetooth IC GR551x family is a single-mode, low-power Bluetooth 5.1 System-on-Chip (SoC). It can be configured as a Broadcaster, an Observer, a Central, or a Peripheral and supports the combination of all the above roles, making it an ideal choice for Internet of Things (IoT) and smart wearable devices.

Based on ARM® Cortex®-M4F CPU core, the GR551x series integrates Bluetooth 5.1 Protocol Stack, a 2.4 GHz RF transceiver, on-chip programmable Flash memory, RAM, and multiple peripherals.

GR551x SoCs are available in multiple packages (see table1) that meet your diverse project demands.

FeaturesGR5515IGNDGR5515IENDUGR5515I0NDAGR5515RGBDGR5515GGBDGR5513BENDGR5513BENDU
CPUCortex®-M4FCortex®-M4FCortex®-M4FCortex®-M4FCortex®-M4FCortex®-M4FCortex®-M4F
RAM256 KB256 KB256 KB256 KB256 KB128 KB128 KB
SiP Flash1 MB512 KBN/A1 MB1 MB512 KB512 KB
I/O Number39393939292222
Package (mm)QFN56 (7 x 7 x 0.75)QFN56 (7 x 7 x 0.75)QFN56 (7 x 7 x 0.75)BGA68 (5.3 x 5.3 x 0.88)BGA55 (3.5 x 3.5 x 0.60)QFN40 (5 x 5 x 0.75)QFN40 (5 x 5 x 0.75)
Operating Temperature-40℃ – 85℃-40℃ – 85℃-40℃ – 85℃-40℃ – 85℃-40℃ – 85℃-40℃ – 85℃-40℃ – 85℃
Supply Voltage Range2.4V – 4.35V2.4V – 4.35V2.4V – 4.35V2.4V – 4.35V2.4V – 4.35V2.4V – 4.35V2.4V – 4.35V
Clocks64 MHz/32 kHz64 MHz/32 kHz64 MHz/32 kHz64 MHz/32 kHz64 MHz/32 kHz64 MHz/32 kHz64 MHz/32 kHz

2. Bluetooth IC GR551X Features

• A Bluetooth Low Energy (Bluetooth LE) 5.1 transceiver integrates Controller and Host layers
◦ Supported data rates: 1 Mbps, 2 Mbps, and Long Range (500 kbps, 125kbps)
◦ TX power: -20 dBm to +7 dBm
◦ -96 dBm sensitivity (in 1 Mbps mode)
◦ -93 dBm sensitivity (in 2 Mbps mode)
◦ -99 dBm sensitivity (in Long Range 500 kbps mode)
◦ -102 dBm sensitivity (in Long Range 125 kbps mode)
◦ TX current: 5.6 mA @ 0 dBm, 1 Mbps
◦ RX current: 4.8 mA @ 1 Mbps
• ARM®Cortex®-M4F 32-bit micro-processor with floating point support
◦ Up to 64 MHz clock frequency

◦  Built-in Memory Protection Unit (MPU) supporting eight programmable regions

◦  Hardware Floating Point Unit (FPU)

◦ Built-in Nested Vectored Interrupt Controller (NVIC)

◦ Non-maskable Interrupt (NMI) input

◦ Serial Wire Debug (SWD) with 6 breakpoints, two watchpoints, and a debug timestamp counter

◦ 51 µA/MHz execution from Flash @ 3.3 V, 64 MHz

  • On-chip memory

◦ 256 KB SRAM with retention capabilities (four 8 KB SRAM blocks and seven 32 KB SRAM blocks) for GR5515 series SoCs, and 128 KB SRAM with retention capabilities (four 8 KB SRAM blocks and three 32 KB SRAM blocks) for the GR5513 SoC

◦8 KB cache SRAM with retention capabilities

◦Stack ROM (including boot ROM and Bluetooth LE Stack)

◦1 MB internal QSPI Flash for GR5515 series SoCs and 512 KB internal QSPI Flash for the GR5513 SoC(exceptions: GR5515I0NDA requiring external QSPI Flash and GR5515IENDU requiring 512 KB embeddedFlash)

  • Digital peripherals

◦One general-purpose DMA engine with 8 channels and 16 handshaking interfaces

  • Analog peripherals

◦One 13-bit Sense ADC with the sampling rate of 1 Msps. It supports up to five external I/O channels and three internal signal channels

◦Built-in temperature and voltage sensors

◦Low-power comparator, supporting wakeup from deep sleep mode

  • Flexible serial peripherals

◦2 x QSPI interfaces, up to 32 MHz

◦2 x UART modules up to 4 Mbps, with all modules supporting flow control and only UART0 supporting DMA

◦2 x I2C modules for peripheral communication, up to 2 MHz

◦1x SPI master interface and 1 x SPI slave interface for host communication, up to 32 MHz

◦2 x I2S interfaces (1 I2S master interface + 1 I2S slave interface)

◦ISO 7816 interface

  • Security

◦Complete secure computing engine:

-AES 128-bit/192-bit/256-bit symmetric encryption (ECB, CBC)

-Hash-based Message Authentication Code (HMAC-SHA256)

-Public key cryptography (PKC)

-True random number generator (TRNG)

◦Comprehensive security operation mechanism:

-Secure boot

-Encrypted firmware running directly from Flash

-eFuse for encrypted key storage

-Differentiate application data key and firmware key, supporting one data key per device/product

  • I/O peripherals

◦39 I/O pins in total

-26 general-purpose I/O (GPIO) pins

-8 always-on I/O (AON IO) pins, supporting wakeup from deep sleep mode

-5 mixed signal I/O (MSIO) pins, configurable to be digital/analog signal interface

  • Timer

◦Two general-purpose, 32-bit timer modules

◦A timer module composed of two programmable 32-bit or 16-bit down counters

◦An internal sleep timer that can be used to wake the device up from deep sleep mode

◦Two PWM modules with edge alignment mode and center alignment mode, each with 3 channels

◦1 x real-time counter (RTC), can be used as Calendar

◦1 x AON watchdog timer, working in both system sleep and active status

  • Power management

◦On-chip DC-DC to provide RF Analog voltage and supply core LDO

◦On-chip I/O LDO to provide I/O voltage and supply external components, maximum I/O LDO drive strength:30 mA

◦Programmable thresholds for brownout detection (BoD reset and BoD interrupt)

◦Supply voltage: 2.2 V to 3.8 V. The supply voltage of GR5515I0NDA (when the external Flash of

GR5515I0NDA is supplied by high voltage) shall equal the working voltage of the external QSPI Flash

◦I/O voltage: 1.8 V to 3.3 V (Typical) (for GR5515I0NDA/GR5515IENDU/GR5513BENDU Flash using high voltage, the VIO_LDO_OUT shall be connected to VBATL in schematic circuit.)

  • Low-power consumption modes

◦Deep sleep mode: 2.7 µA (Typical), with full 256 KB SRAM retention

◦Ultra deep sleep mode: 1.8 µA (Typical), no SRAM retention

◦Off mode: 0.15 uA (Typical), nothing on except VBAT, and chip in reset mode

  • Packages

◦QFN56: 7 mm x 7 mm, 0.40 mm pitch

◦BGA68: 5.3 mm x 5.3 mm, 0.50 mm pitch

◦BGA55: 3.5 mm x 3.5 mm, 0.40 mm pitch

◦QFN40: 5 mm x 5 mm, 0.40 mm pitch

  • Operating temperature range: -40°C to +85°C

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